One of the simplest and most common technique of applying thin films onto wafers is the technique of "spin coating." The process involves simple fluid flow and evaporation behaviors that generally give rather uniform coatings. However, complexities arise with complex coating solutions that often conspire to prevent perfectly flat, high-quality, coatings.
This web site is therefore aimed at exploring this popular technique for depositing thin layers of fluid onto spinning wafers. The index below gives the overall organization and helps direct you to pages that will be most directly related to your interests.
Please enjoy. And, let me know if you have questions or comments about this technique or the materials that I provide here.
Sincerely,
Dunbar
P. Birnie, III
Professor
Department of Materials Science and Engineering
Rutgers University
Application Areas that use Spin-Coating
Fundamental Physics of Spin-Coating
Characteristic Spin-Coating Defects
Overview of My Spin-Coating-Related Prior Work
Other Spin Coating Informational Links
Research Group History Pictures
Current Research and Possible Future Directions
Dunbar
P. Birnie, III
Professor
Department of Materials Science and Engineering
Rutgers, The State University of New Jersey
607 Taylor Rd.
Piscataway, New Jersey, 08854-8065
Major revisions installed in December 2004
Based on earlier version from July 2000
Updated in February 2005.
Page started 1 May 1998
(c) 1998,1999,2000,2004,2005 D. P. Birnie, III