The Spin Coating Process can be broken down into several key stages: fluid dispense, spin-up, stable fluid outflow, and finally evaporation dominated drying. Click Here for Details

Fluid Flow on a flat spinning substrate is one of the most important physical processes involved in spin coating. Click Here for Details

Air Flow above the spinning wafer is also very important since this exerts most control over the evaporation rate of solvent from the solution. Click Here for Details
 

Dunbar P. Birnie, III
Professor
Department of Materials Science and Engineering
Rutgers, The State University of New Jersey   
607 Taylor Rd.
Piscataway, New Jersey, 08854-8065

Major revisions installed in December 2004

Based on earlier version from July 2000
Updated in February 2005.
Page started 1 May 1998
(c) 1998,1999,2000,2004,2005  D. P. Birnie, III